E DIN IEC 60191-6:2007-11

Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

STANDARD published on 1.11.2007

The information about the standard:

Designation standards: E DIN IEC 60191-6:2007-11
Note: WITHDRAWN
Publication date standards: 1.11.2007
The number of pages: 73
Approximate weight : 219 g (0.48 lbs)
Country: German technical standard
Category: Technical standards DIN