E DIN IEC 60191-6-14:2007-03

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).

STANDARD published on 1.3.2007

English and German -
electronic design (pdf) (97.60 USD)

English and German -

Print design (125.00 USD)

The information about the standard:

Designation standards: E DIN IEC 60191-6-14:2007-03
Note: WITHDRAWN
Publication date standards: 1.3.2007
The number of pages: 23
Approximate weight : 69 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60191-6-14:2007-03 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-14: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen mit J-förmigen Anschlüssen (SOJ).