E DIN IEC 60191-6-15:2007-03

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

STANDARD published on 1.3.2007

The information about the standard:

Designation standards: E DIN IEC 60191-6-15:2007-03
Note: WITHDRAWN
Publication date standards: 1.3.2007
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: German technical standard
Category: Technical standards DIN