E DIN IEC 60191-6-17:2007-10

Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA).

STANDARD published on 1.10.2007

English and German -
electronic design (pdf) (128.50 USD)

English and German -

Print design (164.50 USD)

The information about the standard:

Designation standards: E DIN IEC 60191-6-17:2007-10
Note: WITHDRAWN
Publication date standards: 1.10.2007
The number of pages: 49
Approximate weight : 147 g (0.32 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60191-6-17:2007-10 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-17: Konstruktionsleitfaden für gestapelte Gehäuse und individuell stapelbare Gehäuse - Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (FBGA/FLGA).