E DIN IEC 60191-6-18:2008-03

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA).

STANDARD published on 1.3.2008

English and German -
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Print design (180.50 USD)

The information about the standard:

Designation standards: E DIN IEC 60191-6-18:2008-03
Note: WITHDRAWN
Publication date standards: 1.3.2008
The number of pages: 33
Approximate weight : 99 g (0.22 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60191-6-18:2008-03 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA).