E DIN IEC 60191-6-19:2008-03

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage.

STANDARD published on 1.3.2008

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The information about the standard:

Designation standards: E DIN IEC 60191-6-19:2008-03
Note: WITHDRAWN
Publication date standards: 1.3.2008
The number of pages: 48
Approximate weight : 144 g (0.32 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60191-6-19:2008-03 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für Gehäuse-Verbiegungen bei erhöhter Temperatur und die maximal zulässige Verbiegung.