E DIN IEC 60191-6-21:2009-02

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

STANDARD published on 1.2.2009

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The information about the standard:

Designation standards: E DIN IEC 60191-6-21:2009-02
Note: WITHDRAWN
Publication date standards: 1.2.2009
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60191-6-21:2009-02 :

Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP).