E DIN IEC 60749-20-1:2005-02

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices.

STANDARD published on 1.2.2005

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The information about the standard:

Designation standards: E DIN IEC 60749-20-1:2005-02
Note: WITHDRAWN
Publication date standards: 1.2.2005
The number of pages: 52
Approximate weight : 156 g (0.34 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60749-20-1:2005-02 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20-1: Handhabung, Verpackung, Kennzeichnung, Transport und Einsatz von feuchte/reflowlöt-empfindlichen oberflächenmontierbaren Bauelementen.