E DIN IEC 60749-21:2002-06

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability.

STANDARD published on 1.6.2002

English and German -
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The information about the standard:

Designation standards: E DIN IEC 60749-21:2002-06
Note: WITHDRAWN
Publication date standards: 1.6.2002
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60749-21:2002-06 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit.