E DIN IEC 60749-30:2003-06

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing.

STANDARD published on 1.6.2003

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The information about the standard:

Designation standards: E DIN IEC 60749-30:2003-06
Note: WITHDRAWN
Publication date standards: 1.6.2003
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60749-30:2003-06 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 30: Behandlung nicht hermetisch verkappter oberflächenmontierbarer Bauelemente vor Zuverlässigkeitsprüfungen.