E DIN IEC 60749-37:2005-12

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method of components for handheld electronic products.

STANDARD published on 1.12.2005

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The information about the standard:

Designation standards: E DIN IEC 60749-37:2005-12
Note: WITHDRAWN
Publication date standards: 1.12.2005
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60749-37:2005-12 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren freier Fall von Bauelementen auf Leiterplatten für tragbare elektronische Geräte.