E DIN IEC 60749-40:2009-06

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge.

STANDARD published on 1.6.2009

English and German -
electronic design (pdf) (131.00 USD)

English and German -

Print design (167.70 USD)

The information about the standard:

Designation standards: E DIN IEC 60749-40:2009-06
Note: WITHDRAWN
Publication date standards: 1.6.2009
The number of pages: 43
Approximate weight : 129 g (0.28 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 60749-40:2009-06 :

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 40: Prüfverfahren Fall der Leiterplatte unter Verwendung von Dehnungsmessstreifen.