E DIN IEC 61190-1-2:2005-09

Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly.

STANDARD published on 1.9.2005

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The information about the standard:

Designation standards: E DIN IEC 61190-1-2:2005-09
Note: WITHDRAWN
Publication date standards: 1.9.2005
The number of pages: 31
Approximate weight : 93 g (0.21 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 61190-1-2:2005-09 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.