E DIN IEC 61190-1-3/A1:2008-11

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.

STANDARD published on 1.11.2008

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The information about the standard:

Designation standards: E DIN IEC 61190-1-3/A1:2008-11
Note: WITHDRAWN
Publication date standards: 1.11.2008
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 61190-1-3/A1:2008-11 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten.