E DIN IEC 61760-3:2008-09

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering.

STANDARD published on 1.9.2008

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The information about the standard:

Designation standards: E DIN IEC 61760-3:2008-09
Note: WITHDRAWN
Publication date standards: 1.9.2008
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 61760-3:2008-09 :

Oberflächenmontagetechnik - Teil 3: Genormtes Verfahren zur Spezifizierung von Durchsteckmontage-Bauelementen für das Aufschmelzlöten (THR).