E DIN IEC 62047-13:2010-05

Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures.

STANDARD published on 1.5.2010

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The information about the standard:

Designation standards: E DIN IEC 62047-13:2010-05
Note: WITHDRAWN
Publication date standards: 1.5.2010
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 62047-13:2010-05 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 13: Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit mikromechanischer Strukturen.