Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films.
STANDARD published on 1.5.2008
Designation standards: E DIN IEC 62047-8:2008-05
Note: WITHDRAWN
Publication date standards: 1.5.2008
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 8: Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten.