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E DIN IEC 62047-9:2008-03

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS.

STANDARD published on 1.3.2008

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The information about the standard:

Designation standards: E DIN IEC 62047-9:2008-03
Note: WITHDRAWN
Publication date standards: 1.3.2008
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN IEC 62047-9:2008-03 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 9: Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS).