IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly.
STANDARD published on 1.11.1998
Designation standards: E DIN IEC 91/141/CD:1998-11
Note: WITHDRAWN
Publication date standards: 1.11.1998
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: German technical standard
Category: Technical standards DIN
IEC 61190-1-1: Anschlussmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Fluxmittel für hochwertige Verbindungen bei der Elektronikmontage.