Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly.
STANDARD published on 1.11.1998
Designation standards: E DIN IEC 91/142/CD:1998-11
Note: WITHDRAWN
Publication date standards: 1.11.1998
The number of pages: 33
Approximate weight : 99 g (0.22 lbs)
Country: German technical standard
Category: Technical standards DIN
Anschlussmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Weichlöt-Fluxmittel für hochwertige Verbindungen bei der Elektronikmontage.