E DIN IEC 60191-6-5:2010-01

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA).

STANDARD published on 1.1.2010

The information about the standard:

Designation standards: E DIN IEC 60191-6-5:2010-01
Note: WITHDRAWN
Publication date standards: 1.1.2010
The number of pages: 38
Approximate weight : 114 g (0.25 lbs)
Country: German technical standard
Category: Technical standards DIN