GB/T 31475-2015

Requirements for solder paste for high-quality interconnections in electronics assembly

STANDARD published on 15.5.2015

English, Chinese -
electronic design (pdf) (454.80 USD)

The information about the standard:

Designation standards: GB/T 31475-2015
Publication date standards: 15.5.2015
Country: Chinese technical standard
Category: Technical standards GB