GB/T 41853-2022

Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement

STANDARD published on 12.10.2022

English, Chinese -
electronic design (pdf) (460.80 USD)

The information about the standard:

Designation standards: GB/T 41853-2022
Publication date standards: 12.10.2022
Country: Chinese technical standard
Category: Technical standards GB