GB/T 42709.38-2026

Semiconductor devices—Micro-electromechanical devices—Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

STANDARD published on 30.7.2026

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The information about the standard:

Designation standards: GB/T 42709.38-2026
Note: Execute Date: february 2027
Publication date standards: 30.7.2026
Country: Chinese technical standard
Category: Technical standards GB