GB/T 44791-2024

Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation

STANDARD published on 26.10.2024

English, Chinese -
electronic design (pdf) (322.80 USD)

The information about the standard:

Designation standards: GB/T 44791-2024
Publication date standards: 26.10.2024
Country: Chinese technical standard
Category: Technical standards GB