GB/T 4937.201-2026

Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

STANDARD published on 30.4.2026

English, Chinese -
electronic design (pdf) (ON REQUEST)

English, Chinese -

Print design (ON REQUEST)

The information about the standard:

Designation standards: GB/T 4937.201-2026
Note: Execute Date: november 2026
Publication date standards: 30.4.2026
Country: Chinese technical standard
Category: Technical standards GB