Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
STANDARD published on 23.4.1997
Designation standards: IEC 60191-5-ed.2.0
Publication date standards: 23.4.1997
The number of pages: 71
Approximate weight : 213 g (0.47 lbs)
Country: International technical standard
Category: Technical standards IEC
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user. Donne des recommandations applicables aux circuits integres qui sont fournis dans les boitiers utilisant le transfert automatique sur bande (TAB) comme composant principal de fonctions structurales et dinterconnexion. Couvre les exigences pour les bandes avec circuits integres (IC) soudes telles que fournies par un fabricant a un utilisateur.