IEC 60191-6-1-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

STANDARD published on 30.10.2001

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electronic design (pdf) (29.80 USD)

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Print design (29.80 USD)

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CD-ROM (31.70 USD)

Spanish -

electronic design (pdf) (29.80 USD)

Spanish -

Print design (29.80 USD)

Spanish -

CD-ROM (31.70 USD)

The information about the standard:

Designation standards: IEC 60191-6-1-ed.1.0
Publication date standards: 30.10.2001
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-1-ed.1.0 :

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)