IEC 60191-6-10-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

STANDARD published on 19.11.2003

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Print design (119.30 USD)

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CD-ROM (121.20 USD)

English and French -

electronic design (pdf) (119.30 USD)

English and French -

Print design (119.30 USD)

English and French -

CD-ROM (121.20 USD)

The information about the standard:

Designation standards: IEC 60191-6-10-ed.1.0
Publication date standards: 19.11.2003
The number of pages: 24
Approximate weight : 72 g (0.16 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-10-ed.1.0 :

IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON). La CEI 60191-6-10:2003 fournit les dessins dencombrement et les dimensions courantes pour tous les types de structures et de materiaux composes de boitiers en plastique sans sortie, tres faible encombrement (appeles ci-apres P-VSON).