IEC 60191-6-17-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

STANDARD published on 27.1.2011

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The information about the standard:

Designation standards: IEC 60191-6-17-ed.1.0
Publication date standards: 27.1.2011
The number of pages: 53
Approximate weight : 159 g (0.35 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-17-ed.1.0 :

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA. La CEI 60191-6-17:2011 fournit les dessins dencombrement et les dimensions pour les boitiers empiles et les boitiers empilables individuels sous forme de FBGA ou FLGA.