Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
STANDARD published on 7.1.2010
Designation standards: IEC 60191-6-18-ed.1.0
Publication date standards: 7.1.2010
The number of pages: 40
Approximate weight : 120 g (0.26 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy. La CEI 60191-6-18:2010 fournit des dessins dencombrement, des dimensions et des variations recommandees normalises pour tous les boitiers matriciels a billes de forme carree (BGA), dont le pas de sortie est superieur ou egal a 1 mm. La presente norme annule et remplace lIEC/PAS 60191-6-18 publie en 2008. Cette premiere edition constitue une revision technique. Le contenu des corrigenda de mai 2010 et juillet 2010 a ete pris en consideration dans cet exemplaire.