IEC 60191-6-18-ed.1.0/Cor.1

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

STANDARD published on 31.5.2010

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The information about the standard:

Designation standards: IEC 60191-6-18-ed.1.0/Cor.1
Note: Correction
Publication date standards: 31.5.2010
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC