IEC 60191-6-18-ed.1.0/Cor.2

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

STANDARD published on 28.7.2010

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The information about the standard:

Designation standards: IEC 60191-6-18-ed.1.0/Cor.2
Note: Correction
Publication date standards: 28.7.2010
The number of pages: 1
Approximate weight : 3 g (0.01 lbs)
Country: International technical standard
Category: Technical standards IEC