Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
STANDARD published on 25.2.2010
Designation standards: IEC 60191-6-19-ed.1.0
Publication date standards: 25.2.2010
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision. La CEI 60191-6-19:2010 couvre les exigences relatives aux methodes de mesure du gauchissement des boitiers a temperature elevee et du gauchissement maximum admissible pour les boitiers BGA, FBGA et FLGA. La presente norme annule et remplace lIEC/PAS 60191-6-19 publie en 2008. Cette premiere edition constitue une revision technique.