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IEC 60191-6-2-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

STANDARD published on 11.12.2001

English -
electronic design (pdf) (59.70 USD)
English -
Print design (59.70 USD)
English -
CD-ROM (61.50 USD)


Spanish -
electronic design (pdf) (59.70 USD)
Spanish -
Print design (59.70 USD)
Spanish -
CD-ROM (61.50 USD)


English and French -
electronic design (pdf) (59.70 USD)
English and French -
Print design (59.70 USD)
English and French -
CD-ROM (61.50 USD)

The information about the standard:

Designation standards: IEC 60191-6-2-ed.1.0
Publication date standards: 11.12.2001
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-2-ed.1.0 :

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA). La CEI 60191-6-2:2001 couvre les exigences de preparation des dessins dencombrement de circuits integres pour les divers boitiers a bornes en forme de billes, par exemple boitiers matriciels a billes en ceramique (C-BGA), boitiers matriciels a billes en plastique (P-BGA), boitiers matriciels a billes sur bande (T-BGA) et autres, et aussi boitiers a bornes en forme de colonnes, par exemple boitiers matriciels a colonnes en ceramique (C-CGA).