IEC 60191-6-20-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

STANDARD published on 30.8.2010

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The information about the standard:

Designation standards: IEC 60191-6-20-ed.1.0
Publication date standards: 30.8.2010
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-20-ed.1.0 :

IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4. La CEI 60191-6-20:2010 specifie les methodes destinees a mesurer les dimensions des boitiers a sortie en J (SOJ) de faible encombrement, lencombrement des boitiers de forme E conformement a la CEI 60191-4.