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IEC 60191-6-22-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

STANDARD published on 11.12.2012

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The information about the standard:

Designation standards: IEC 60191-6-22-ed.1.0
Publication date standards: 11.12.2012
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-22-ed.1.0 :

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). La CEI 60191-6-22:2012 fournit les dessins dencombrement et les dimensions associees, communs aux structures et materiaux des boitiers en silicium des boitiers matriciels a billes (BGA, ball grid array) et des boitiers matriciels a zone de contact plate (LGA, land grid array).