IEC 60191-6-3-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

STANDARD published on 29.9.2000

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electronic design (pdf) (171.50 USD)

English and French -

Print design (171.50 USD)

English and French -

CD-ROM (173.40 USD)

The information about the standard:

Designation standards: IEC 60191-6-3-ed.1.0
Publication date standards: 29.9.2000
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-3-ed.1.0 :

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. La CEI 60191-6-3:2000 stipule une methode de mesure des dimensions des boitiers plats quadrangulaires (QFP) qui sont classes dans la forme E.