IEC 60191-6-4-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

STANDARD published on 11.6.2003

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electronic design (pdf) (119.30 USD)

English and French -

Print design (119.30 USD)

English and French -

CD-ROM (121.20 USD)

The information about the standard:

Designation standards: IEC 60191-6-4-ed.1.0
Publication date standards: 11.6.2003
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-4-ed.1.0 :

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. La CEI 60191-6-4:2003 couvre les exigences relatives aux methodes de mesure des dimensions des boitiers matriciels a billes (BGA).