IEC 60191-6-5-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

STANDARD published on 27.8.2001

English -
electronic design (pdf) (59.70 USD)

English -

Print design (59.70 USD)

English -

CD-ROM (61.50 USD)

Spanish -

electronic design (pdf) (59.70 USD)

Spanish -

Print design (59.70 USD)

Spanish -

CD-ROM (61.50 USD)

The information about the standard:

Designation standards: IEC 60191-6-5-ed.1.0
Publication date standards: 27.8.2001
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-5-ed.1.0 :

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.