Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

The information about the standard:

Designation standards: IEC 60191-6-6-ed.1.0
Publication date standards: 22.3.2001
The number of pages: 25
Approximate weight : 75 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-6-ed.1.0 :

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. La CEI 60191-6-6:2001 fournit les dessins dencombrement et les dimensions courants de tous les types de structures et de materiaux composes des boitiers matriciels a plots et a pas fin (appeles ci-apres FLGA) dont le pas des bornes est inferieur ou egal a 0,80 mm et dont lencombrement du corps du boitier est carre.