Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

The information about the standard:

Designation standards: IEC 60191-6-8-ed.1.0
Publication date standards: 27.8.2001
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60191-6-8-ed.1.0 :

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP. La CEI 60191-6-8:2001 fournit les dessins dencombrement et les dimensions courants de tous les types de structures et de materiaux composes de boitiers plats quadrangulaires en ceramique, scellement verre (appeles ci-apres G-QFP). Lobjectif du present guide de conception est de normaliser les encombrements et dobtenir linterchangeabilite des G-QFP.