IEC 60512-6-2-ed.1.0

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

STANDARD published on 21.2.2002

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The information about the standard:

Designation standards: IEC 60512-6-2-ed.1.0
Publication date standards: 21.2.2002
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60512-6-2-ed.1.0 :

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump. Etablit une methode d'essai normalisee pour evaluer l'aptitude d'un composant (essentiellement un connecteur) a supporter des secousses a des severites specifiees.