
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
STANDARD published on 22.10.2024
Designation standards: IEC 60747-15-ed.3.0
Publication date standards: 22.10.2024
The number of pages: 115
Approximate weight : 376 g (0.83 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60747-15:2024 gives the requirements for isolated power semiconductor devices. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices and parts of IEC 60748 for ICs. This third edition includes the following significant technical changes with respect to the previous edition: a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C); b) The thermal resistance is described for each switch (6.2.4); c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2). LIEC 60747-15:2024 specifie les exigences relatives aux dispositifs de puissance a semiconducteurs isoles. Ces exigences s’ajoutent a celles qui figurent dans d’autres parties de l’IEC 60747 pour les dispositifs de puissance non isoles correspondants et dans des parties de l’IEC 60748 pour les circuits integres. Cette troisieme edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente: a) les modules de puissance a semiconducteurs intelligents (IPM, Intelligent Power semiconductor Module), qui etaient auparavant exclus des premiere et deuxieme editions, sont desormais inclus dans le present document (Annexe C); b) la resistance thermique est decrite pour chaque interrupteur (6.2.4); c) ajout d’un essai d’isolement entre le capteur de temperature et les bornes, en cas d’accord avec l’utilisateur (6.1.2).