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IEC 60749-14-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

STANDARD published on 7.8.2003

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English and French -
electronic design (pdf) (124.60 USD)
English and French -
Print design (124.60 USD)
English and French -
CD-ROM (126.50 USD)

The information about the standard:

Designation standards: IEC 60749-14-ed.1.0
Publication date standards: 7.8.2003
The number of pages: 27
Approximate weight : 81 g (0.18 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60749-14-ed.1.0 :

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user. Fournit plusieurs essais pour la determination de lintegrite entre linterface connexion/boitier et la connexion elle-meme lorsque la ou les connexions sont pliees en raison dun assemblage incorrect de carte suivi dune retouche de la partie concernee pour un nouvel assemblage. Applicable a tous les dispositifs a montage par trous traversants et a montage en surface exigeant que lutilisateur forme la connexion.