IEC 60749-19-ed.1.0

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

STANDARD published on 13.2.2003

Spanish -
electronic design (pdf) (29.40 USD)

Spanish -

Print design (29.40 USD)

Spanish -

CD-ROM (31.20 USD)

English and French -

electronic design (pdf) (29.40 USD)

English and French -

Print design (29.40 USD)

English and French -

CD-ROM (31.20 USD)

The information about the standard:

Designation standards: IEC 60749-19-ed.1.0
Publication date standards: 13.2.2003
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 60749-19-ed.1.0 :

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor. Determine la coherence des materiaux et des methodes dessai utilisees pour fixer les pastilles a semiconducteurs aux embases de boitiers ou autres substrats. Generalement applicable aux seuls boitiers a cavite ou comme moniteur de processus.