Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
STANDARD published on 28.7.2010
Designation standards: IEC 60749-19-ed.1.0/Amd.1
Note: Change
Publication date standards: 28.7.2010
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: International technical standard
Category: Technical standards IEC