IEC 60749-8-ed.1.0/Cor.1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

STANDARD published on 23.4.2003

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The information about the standard:

Designation standards: IEC 60749-8-ed.1.0/Cor.1
Note: Correction
Publication date standards: 23.4.2003
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC