Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

The information about the standard:

Designation standards: IEC 61188-6-2-ed.1.0
Publication date standards: 4.2.2021
The number of pages: 49
Approximate weight : 147 g (0.32 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61188-6-2-ed.1.0 :

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017. L’IEC 61188-6-2:2021 decrit les exigences de conception et d’utilisation relatives aux surfaces de brasage de la zone de report sur les cartes imprimees. Le present document porte notamment sur la zone de report des composants montes en surface. Ces exigences se fondent sur les exigences relatives aux joints de brasure de l’IEC 61191-2:2017.