Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

The information about the standard:

Designation standards: IEC 61189-2-804-ed.1.0
Publication date standards: 25.8.2023
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 61189-2-804-ed.1.0 :

IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values. LIEC 61189-2-804:2023 definit une methode dessai pour determiner le temps de decollement interlaminaire des materiaux de base et des cartes imprimees en utilisant un analyseur thermomecanique (TMA – thermomechanical analyser). Les temperatures utilisees pour cette evaluation sont generalement 260 °C, 288 °C et 300 °C, mais ne se limitent pas a ces valeurs.